- Datum18.11.2025
- Uhrzeit17:00 - 18:00 Uhr
- Veranstalter
stock3
ChipMOS Technologies Inc. R.Shs(Sp.ADRs)/20 TA 10 Aktie
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ChipMOS Technologies Inc. R.Shs(Sp.ADRs)/20 TA 10 Realtime-Kurs
| Handelsplatz | Kurs | +/- (%) | +/- (abs) | Vortag | Zeit | Aktionen |
|---|---|---|---|---|---|---|
| L&S | VK | |||||
| Tradegate | VK | |||||
| Stuttgart | VK |
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| WKN | Long/Short | KO | Hebel | Laufzeit | Bid | Ask |
|---|
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Wertentwicklung (Nasdaq)
10,00 %
Intraday
40,67 %
1 Woche
55,34 %
1 Monat
63,67 %
Seit Jahresbeginn
57,89 %
1 Jahr
43,62 %
3 Jahre
46,07 %
5 Jahre
73,34 %
10 Jahre
Passender Service zu ChipMOS Technologies Inc. R.Shs(Sp.ADRs)/20 TA 10
Webinar zu ChipMOS Technologies Inc. R.Shs(Sp.ADRs)/20 TA 10
Kursinformationen (Nasdaq)
- Tagestief / Hoch ($)-
- 52W-Tief / Hoch ($)12,783-30,981
- Jahrestief / Hoch ($)---
- Schlusskurs (Vortag)
- Eröffnungskurs
- Volumen Intraday
Wichtigste Eigenschaften
Dividenden von ChipMOS Technologies Inc. R.Shs(Sp.ADRs)/20 TA 10
| Ex-Datum | Fiskaljahr | Dividende | Rendite |
|---|---|---|---|
| - | 2025 (e) | ||
| 27.06.2025 | 2024 | 0,835969 $ | 4,29 % |
| 27.06.2024 | 2023 | 1,098163 $ | 4,03 % |
| 29.06.2023 | 2022 | 1,476772 $ | 5,69 % |
| 29.06.2022 | 2021 | 2,875965 $ | 9,33 % |
| 06.08.2021 | 2020 | 1,58155 $ | 3,74 % |
| 07.08.2019 | 2019 | 0,763894 $ | 4,19 % |
| 01.07.2020 | 2019 | 1,226742 $ | 5,39 % |
| 01.11.2018 | 2018 | 0,968545 $ | 7,38 % |
Termine von ChipMOS Technologies Inc. R.Shs(Sp.ADRs)/20 TA 10
Keine aktuellen Termine
Beschreibung
ChipMOS TECHNOLOGIES INC. engages in the research, development, manufacture, and sale of high-integration and high-precision integrated circuits, and related assembly and testing services in Taiwan, People's Republic of China, Japan, Singapore, and internationally. It operates through Testing; Assembly; Testing and Assembly for LCD, OLED and other Display Panel Driver Semiconductors; Bumping; and Other segments. The company provides a range of back-end assembly and testing services, including engineering test, wafer probing, and final test of memory and logic/mixed-signal semiconductors, as well as leadframe-based and organic substrate-based package assembly services for memory and logic/mixed-signal semiconductors; and gold bumping, reel to reel assembly, and test services for LCD and other panel display driver semiconductors. Its semiconductors are used in personal computers; graphics applications, such as game consoles; communications equipment; mobile products comprising cellular handsets, tablets, and consumer electronic products; and automotive/industry and display applications, such as display panels. The company was incorporated in 1997 and is headquartered in Hsinchu, Taiwan.
