AIXTRON delivers G10-AsP for production of next generation photonics to Nokia
- Lesezeichen für Artikel anlegen
- Artikel Url in die Zwischenablage kopieren
- Artikel per Mail weiterleiten
- Artikel auf X teilen
- Artikel auf WhatsApp teilen
- Ausdrucken oder als PDF speichern
Erwähnte Instrumente
- VerkaufenKaufen
EQS-Media / 01.04.2025 / 07:30 CET/CEST
Herzogenrath, 01. April 2025 – AIXTRON SE (FSE: AIXA) to supply Nokia with its G10-AsP system. The G10-AsP will enable Nokia to produce 6-inch Indium Phosphide (InP) wafers, marking a significant milestone in the evolution of Photonic Integrated Circuits (PICs).
Photonic Integrated Circuits (PICs) are vital for today's megatrends such as high-speed data communication, 5G, sensing, and AI. The global market for PICs is expected to grow substantially over the next few years: Valued at around USD 12 billion in 2023, the market is expected to reach USD 41 billion by 2031, implying a compound annual growth rate (CAGR) of approximately 16%.[1]
Since introducing the industry’s first large-scale photonic integrated circuits, Nokia continues to lead the industry with its PIC-based coherent optical engine technology to deliver ever greater scale and performance. Leveraging high-performance Indium Phosphide (InP), Nokia’s PICs integrate a wide range of optical functions on a single chip, reducing cost, footprint, and power consumption while enhancing performance and reliability.
AIXTRON's G10-AsP system excels in providing precise and uniform processes that PICs require in contrast to traditional transceivers, as demonstrated in particular on 6-inch InP wafers. For example, thanks to an innovative injector and advanced temperature control the platform offers up to 4x superior on-wafer-uniformity for critical layers compared to the previous generation. Combined with In-Situ Cleaning, these new levels of uniformities can be consistently reproduced without the need for hardware exchange or calibration between the different growth steps of the complex circuits. The automated Cassette-to-Cassette (C2C) wafer loading ensures highest operator efficacy for the MOCVD tool.
"We are thrilled to support Nokia’s innovation in photonic integrated circuits with our G10-AsP system. The ability to produce 6-inch InP wafers will significantly enhance their manufacturing and technology capabilities and drive the adoption of next-generation optical technologies," said Dr. Felix Grawert, CEO and President of AIXTRON SE.
Steve Stockman, who leads Nokia’s InP-based PIC manufacturing added: "The acquisition of AIXTRON's state of the art G10-AsP platform is a strategic investment in our production capabilities. This advanced technology will enable us to meet the growing demand for high-performance photonic integrated circuits and expand our leadership in the industry."
The transition to 6-inch InP wafers represents a significant advancement for the photonic integrated circuit industry. Larger wafer sizes enable higher production volumes and reduced per-unit cost while accessing superior manufacturing technology. This shift is particularly important for high-demand sectors such as telecommunications, automotive, and data centers, where high-frequency, high-bandwidth data transmission is critical.
Contact
Christian Ludwig
Vice President Investor Relations & Corporate Communications
fon +49 (2407) 9030-444
e-mail c.ludwig@aixtron.com
About AIXTRON:
AIXTRON SE is a leading provider of deposition equipment to the semiconductor industry. The Company was founded in 1983 and is headquartered in Herzogenrath (near Aachen), Germany, with subsidiaries and sales offices in Asia, United States, and in Europe. AIXTRON´s technology solutions are used by a diverse range of customers worldwide to build advanced components for electronic and optoelectronic applications based on compound or organic semiconductor materials. Such components are used in a broad range of innovative applications, technologies and industries. These include Laser and LED applications, display technologies, data transmission, SiC and GaN power management and conversion, communication, signaling and lighting as well as a range of other leading-edge applications.
Our registered trademarks: AIXACT®, AIXTRON®, Atomic Level SolutionS®, Close Coupled Showerhead®, CRIUS®, Gas Foil Rotation®, OVPD®, Planetary Reactor®, PVPD®, TriJet®
For further information on AIXTRON (FSE: AIXA, ISIN DE000A0WMPJ6) please visit our website at: www.aixtron.com.
Forward-Looking Statements
This document may contain forward-looking statements regarding the business, results of operations, financial condition, and earnings outlook of AIXTRON. These statements may be identified by words such as “may”, “will”, “expect”, “anticipate”, “contemplate”, “intend”, “plan”, “believe”, “continue” and “estimate” and variations of such words or similar expressions. These forward-looking statements are based on our current assessments, expectations and assumptions, of which many are beyond control of AIXTRON, and are subject to risks and uncertainties. You should not place undue reliance on these forward-looking statements. Should these risks or uncertainties materialize or should underlying expectations not occur or assumptions prove incorrect, actual results, performance, or achievements of AIXTRON may materially vary from those described explicitly or implicitly in the relevant forward-looking statement. This could result from a variety of factors, such as actual customer orders received by AIXTRON, the level of demand for deposition technology in the market, the timing of final acceptance of products by customers, the condition of financial markets and access to financing for AIXTRON, general conditions in the market for deposition plants and macroeconomic conditions, cancellations, rescheduling or delays in product shipments, production capacity constraints, extended sales and qualification cycles, difficulties in the production process, the general development in the semiconductor industry, increased competition, fluctuations in exchange rates, availability of public funding, fluctuations and/or changes in interest rates, delays in developing and marketing new products, a deterioration of the general economic situation and any other factors discussed in any reports or other announcements , in particular in the chapter Risks in the Annual Report, filed by AIXTRON. Any forward-looking statements contained in this document are based on current expectations and projections of the executive board based on information available the date hereof. AIXTRON undertakes no obligation to revise or update any forward-looking statements as a result of new information, future events or otherwise, unless expressly required to do so by law.
This document is also available in a German language translation version. In case of discrepancies, the English language document shall prevail and shall be the valid version.
[1] According to a report from Market and Data.
End of Media Release
Issuer: AIXTRON SE
Key word(s): Enterprise
01.04.2025 CET/CEST Dissemination of a Press Release, transmitted by EQS News - a service of EQS Group.
The issuer is solely responsible for the content of this announcement.
The EQS Distribution Services include Regulatory Announcements, Financial/Corporate News and Press Releases.
Archive at www.eqs-news.com
Language:
English
Company:
AIXTRON SE
Dornkaulstraße 2
52134 Herzogenrath
Germany
Phone:
+49 (2407) 9030-0
Fax:
+49 (2407) 9030-445
E-mail:
invest@aixtron.com
Internet:
www.aixtron.com
ISIN:
DE000A0WMPJ6
WKN:
A0WMPJ
Indices:
MDAX, TecDAX
Listed:
Regulated Market in Frankfurt (Prime Standard); Regulated Unofficial Market in Berlin, Dusseldorf, Hamburg, Hanover, Munich, Stuttgart, Tradegate Exchange; Nasdaq OTC
EQS News ID:
2109382
End of News
EQS Media
2109382 01.04.2025 CET/CEST
Passende Produkte
WKN | Long/Short | KO | Hebel | Laufzeit | Bid | Ask |
---|